Finnish food expo co-locates with packaging and graphics shows

FINLAND – The second edition of the food technology trade fair, FoodTec 2010, will be co-located with two related events.

The trade fair for food industry production technology professionals, held at the Helsinki Exhibition and Convention Centre on 21–24 September, is expected to attract more than 200 exhibitors. This year’s event will also include packaging event, PacTec 2010, and the debut edition of GrafTec 2010, a trade fair for the graphics industry.

The previous FoodTec was held in conjunction with the PacTec event in 2007, attracting more than 8,000 industry professionals.

A key component of this year’s FoodTec will be a discussion panel on the risks and opportunities of internationalisation, chaired by Heikki Manner of the Finnish Society of Food Science and Technology.

“The internationalisation of the food industry is tied to agricultural production. Finland’s farm sector produces too much barley and wheat, and tries to export the excess as bulk raw materials,” he said. “As the popularity of organic food is increasing around the world, would it make sense for Finland to concentrate on exporting organic goods.”